LAIRD Tflex HD7.5 Thermal Gap Filler

Product Details

Product Description

Product Description
FEATURES AND BENEFITS
1. 7.5 W/mK thermal conductivity
2. Low pressure versus deflection
3. Minimizes board and component stress
4. Low Outgassing and oil bleeding
5. Large tolerance applications
Laird Tflex HD7.5 gap filler is a new developed very soft silicone material in our high deflection series.
With a thermal conductivity of 7.5W/ mk, Tflex HD7.5 is designed to provide superior pressure versus deflection characteristics.
The material will provide minimal stress on components during application while maintaining low thermal resistance.
As a result, less mechanical and thermal stresses will be experienced within your device.
LAIRD Tflex HD7.5 gap filler is available in thickness from 1mm (0.040”) to 5mm (0.200”).

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