| Article | Description | Capability |
| Sercive | PCB and SMT assembly with one-stop service | |
| Material | Laminate materials | FR4, high TG FR4, high frequency, alum, |
| Board cutting | Number of layers | 1-48 layers |
| Min.thickness for inner layers | 0.003"(0.07mm) | |
| (Cu thickness are excluded) | ||
| Standard | (0.1-4mm±10%) | |
| Board thickness | Min. | Single/Double:0.008±0.004"/4layer:0.01±0.008" 8layer:0.01±0.008" |
| Bow and twist | no more than 7/1000 | |
| Copper weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Min size | 0.0078"(0.2mm) | |
| Drilling | Drill deviation | ±0.002″(0.05mm) |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Color | Green,white,black,red,blue… | |
| Solder mask | Min solder mask clearanace | 0.003″(0.07mm) |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… |
| Min Size | 0.006″(0.15mm) | |
| E-test | Function Test | 100% Functional test |
| PCBA Testing | ,AOI Test,Functional test | |
| Pcb assembly | one-stop service electronic manufacxturer service | |
| Certificate | ISO9001:2015 | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| package | QFN,BGA,SSOP,PLCC,LGA | |
| Sub-assembly | Plastic,metal,screen |
