Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, is used for cutting and slotting of electronic and optical components.
D(mm)
| T(mm)
| U(mm)
| H(mm)
| X(mm)
|
4” /100
| 0.5, 0.6, 0.8, 1.0, 1.2, 1.5
| 0.4, 0.5, 0.6, 0.8, 1.0, 1.3.
| 20, 31.75
| 5, 10
|
5”/ 125
| 0.5, 0.6, 0.8, 1.0, 1.2, 1.5
| 0.4, 0.5, 0.6, 0.8, 1.0, 1.3
| 20, 31.75
| 5, 10
|
6”/ 150
| 0.6, 0.8, 1.0, 1.2, 1.5, 1.8
| 0.5, 0.6, 0.8, 1.0, 1.3, 1.6
| 20, 31.75
| 5, 7, 10
|
8”/ 200
| 0.8, 1.0, 1.2, 1.5, 1.8
| 0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5.
| 20, 31.75
| 5, 7, 10
|
12”/ 300
| 1.0, 1.2, 1.4, 1.5, 1.7, 1.8
| 0.7, 0.9, 1.1, 1.4
| 20, 31.75
| 5, 7, 10
|
16”/ 400
| 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3
| 0.9, 1.2, 1.4, 1.6, 2.0
| 20, 31.75
| 5, 7, 10
|
20”/ 500
| 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3
| 0.9, 1.2, 1.4, 1.6, 2.0
| 20, 31.75
| 5, 7, 10
|
Other size can be made according to customers’ requirement
|
– Excellent cutting ability that help reduce chipping, fractures and achieve smooth surface finish
– Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc.
– Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to 250μm depending on blade thickness
