CF2260 Diamond Wire Sawing Machine for Optical Glass

Product Description

Product Description
CF2260 Multi-wire Saw
CF2260 Multi-wire Saw is a straight cutting equipment integrating the characteristics of previous mature models and is designed based on improving production efficiency and stability. The equipment is suitable for straight slicing of Rare Earth Permanent Magnet, Quartz Crystal, Optical Glass, Precious Metal and other hard and brittle materials. It is suitable for the cutting of products within 0.5-15mm thickness. It has the characteristics of high processing efficiency, strong running stability and wide process applicability.
Product Features
>Stable Wire Web Control
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire web shaking.
>Optimized Pulley System
8 pulleys design can reduce diamond wire torsion, tension fluctuation and wire breakage rate.
>Easy Wire Winding
The wire pay-off wheel adopts the standard universal spool (PV600 reinforced I-wheel), and it's no need to rewind.
>Safety Guarantee
The main operation door can be raised and lowered electrically with safety device.
>Wire break memory system.
>Easy Operation
The cutting room is open on 3 sides for easier operation and maintenance.
Cut Samples

Product Parameters

Detail	Parameter
Model	CF2260
Maximum work size	220mm×600mm×180mm
Roller out diameter *Workable width	(φ180mm±10)x610mmx3
Wire Diameter	φ0.12mm-φ0.25mm
Wire spool storage	40km(φ0.25mm)
Maximum running speed	Max1500m/min
Travel of table	Max255mm
Cutting method	Vertically upward movement
Cutting feed speed	0.1-99.9mm/min
Cutting Fluid	Water-based cutting fluid or cutting oil
Fluid Storage	800L
Fluid flow rate	200L/min
Power supply	Three-phase 380V 50Hz
Power	40kw
Air supply	More than 0.4MPa
Size L*W*H	3400mm*2200mm*2700mm
Weight	7500Kg

About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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