CX680C Multi Wire Sawing Machine for Optical Glass

Product Description

Product Description
CX680C Multi-wire Saw
CX680 Multi-wire Saw is mainly used for straight slicing of Rare Earth Permanent Magnet, Quartz Crystal, Optical Glass, Precious Metal and other hard and brittle materials. The machine adopts four rollers direct drive + roller rotation adjustment structure, which can achieve the cutting of products within 30mm.
Product Features
>Double Worktable
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Whole-casted Frame
The whole casting structure has high damping coefficient and excellent vibration damping performance.
>Stable Wire Web Control
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire net shaking.
>Save Labor and Time
The roller auxiliary disassembly bracket can effectively reduce the labor intensity and disassembly time.
>Easy Operation
The cutting room is open on 3 sides for easier operation and maintenance.
>Safety Guarantee
The main operation door can be raised and lowered electrically with safety device.
>Wire break memory system.
Cut Samples

Product Parameters

Detail	Parameter
Model	CX680C
Maximum work size	160×680×160mm
Workbench quantity	2
Roller out diameter*Workable width	(φ155±10mm)x690x4
Wire Diameter	φ0.12mm-φ0.25mm
Wire spool storage	40km(φ0.25mm)
Maximum running speed	1200m/min
Travel of worktable lifting	245mm
Cutting method	Vertically upward movement
Cutting feed speed	0.1-99.9mm/min
Cutting fluid	Water-based cutting fluid or cutting oil
Fluid storage	800L
Fluid flow rate	200L/min
Power supply	380V±10% 50Hz
Power	41Kw
Air supply	Adopting water-based cutting fluid, the air pressure is ≥0.4MPa.
Size L*W*H	2950*1920*2500mm
Weight	6000Kg

About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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