Double-Sided Grinding Equipment with High Precision and Easy Maintenance

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Special points:
1: The operation of the series grinding machine is driven by four motors, which can speed the upper grinding disc, the lower grinding disc, the gear ring and the sun wheel separately, so that the grinding can achieve the best speed ratio, and the sun wheel relative to the other three speeds can be stepless speed regulation, so that the cruise ship can achieve positive rotation and reverse, to meet the needs of different grinding and repair processes.
2: The series of grinding machine is the lifting mode of the lower grinding disc, and the high and low position of the lower grinding disc can stay self-locking within the total travel range to meet the needs of changing the high and low position of the engagement of the cruise ship;
3: The series of grinding machine adopts four stages of pressure, that is, the operation process of light pressure, medium pressure, heavy pressure and repair;
4: Series grinding machine adopts PLC program control system, frequency conversion speed regulation, touch screen operation panel, motor speed and running time can be directly input on the touch screen.
5: The grating thickness control system can be increased according to user requirements, and the thickness tolerance of the product after processing can be controlled within the range of ±0.002mm.
APPLICATION

Process	Industry by Substance	Industry by Applicability
Double Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed.

SPECIFICATION

Standard Specification
Machine Model	FD6B		FD9B		FD13-6B
Lower Plate Diameter	Φ386 mm / 15 inches		Φ640 mm / 25 inches		Φ973 mm / 38 inches
Upper Plate Diameter	Φ386 mm / 15 inches		Φ640 mm / 25 inches		Φ973 mm / 38 inches
Star Wheel Parameter	DP 12, Z=66, A=20°		DP 12, Z=108, A=20°		DP 19.3, Z=152, A=20°
Conditioning Ring Parameter	DP 12, Z=66, A=20°		DP 12, Z=108, A=20°		DP 19.3, Z=152, A=20°
Max. Workpiece Diameter	Φ120 mm		Φ180 mm		Φ290 mm
Process Thickness	0.2mm≤N≤20mm		0.2mm≤N≤25mm		0.2mm≤N≤30mm
Number of Station	3≤N≤5		3≤N≤5		3≤N≤5
Plate Rotate Speed	0-60 rpm		0-60 rpm		0-50 rpm
Total Weight	600 kg		2000 kg		3200 kg
Total Floor Space	700×950 mm		1350x960 mm		1700×1380 mm
Built-In Optional Kits
Grade		Standard		Advanced
Slurry Supply System		-		Integrated with PLC
Facing and Grooving System		-		Integrated with PLC
Machine Enclosure		-		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)
Patent
About the Company Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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