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Custom HDI Multilayer Medical Electronics Printed PCB Circuit Boards SMT PCBA OEM Design Service Assembly Manufacturer

US$1.00
10-49 Pieces
US$0.80
50-99 Pieces
US$0.70
100-499 Pieces
US$0.60
500-999 Pieces
US$0.50
1,000+ Pieces

Basic Info.

Layers
Multilayer
Base Material
FR-4
Certification
RoHS, CCC, ISO
Customized
Customized
Condition
New
Shape
DIP
Conductive Type
Bipolar Integrated Circuit
Integration
Gsi
Technics
Semiconductor IC
D/C
Standard
Warranty
2 Years
Mounting Type
Standard, SMT, DIP
Cross Reference
Standard
Memory Type
Standard
Transport Package
Carton
Specification
unlimited
Trademark
Mustar
Origin
Shenzhen
Production Capacity
506140

Product Description


Welcome to Mu Star (Shenzhen) Industry Co., LTD
Our Advantages 1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, PCB Assembly, Housing and assembly,
Box Building, OEM Service.
4. Certifications: 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949
5. The warranty period for PCBA: 2 years.
6. About Factory: 16 SMT Lines, 4 DIP Lines, 1 X-Ray, 32 AOI, 2 Sample test machines.
Specification
1 Material FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc.
2 Board thickness Mass production: 394mil(10mm) Samples: 17.5mm
3 Surface finish HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
4 PCB Max panel size 1150mm × 560mm
5 Layer Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers
6 Min hole size Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
7 PCBA QC X-Ray, AOI Test, Functional Test
8 Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
9 Our service PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers
10 Sanforized Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
11 SMT Capacity 700 Million Points/Day
12 DIP Capacity 5 Million Points/Day
13 Certificate CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949


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