Product Details
Product Description
Product Description
Single layerflexible FPC,double layerflexible FPC,multi-layerflexible FPC,HDI flexible FPC
High-end double-sided, multi-layer, flexible, high-frequency, HDI arbitrary interconnection, metal base, high thermal conductivity metal base, ceramics, cut-in metal base, cut-in buried capacitance, cut-in thick copper buried magnet, concave and convex steps Substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll-to-roll FPC, long FPC, large-size printed circuit board, halogen-free material, high Frequency materials, high-speed materials, metal materials, environmentally friendly circuit boards, blind and buried via circuit boards, high thermal conductivity aluminum base, thermoelectric separation copper base, PDU busbars, iron base and metal base (core) hybrid boards, inlaid copper buried copper, buried Resistive buried capacitive ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper board, thick gold-plated board, HDI, any order (cross-blind burial) Anylayer , double-sided, multi-layer, HDIFPC, soft-hard HDI, roll-to-roll FPC, extra-long FPC, extra-large size board PCB production and product design and product development, software development, special material printed circuit boards and other integrated OEM and ODM production factory.
The company mainly produces surface treatment technology immersion gold, electro-nickel gold, electro-thick gold, immersion gold + OSP, electro-nickel gold + immersion gold, electro-nickel gold + immersion gold + OSP, electro-gold + OSP, immersion gold + gold finger, OSP + Gold finger, lead-free spray tin, lead-free spray tin + immersion gold, lead-free spray tin + gold finger, lead spray tin, OSP, immersion tin, immersion silver, electro-silver
Vacuum packaging+tin foil+cardboard box+packaging tape+wooden pad
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