|
US$15.00-30.00
|
250 sheet
(MOQ)
|
Basic Info.
Application
Consumer Electronics
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Additive Process
Sheet Thickness
0.6-2.0mm
Copper Thickness
15um, 18um, 25um, 35um, 70um, Others
Protective Film Color
Green
Thermal Conductivity
0.6~2.0W
Aluminum Base Material
1060 / 5052
Breakdown Voltage
AC>/=5kv
Specification
1000*1200MM, 500*600MM, others
Production Capacity
200000 Sheets Per Month
Packaging & Delivery
Package Size
123.00cm * 103.00cm * 58.00cm
Package Gross Weight
1343.000kg
Product Description
Aluminum Copper Clad Laminate Sheet
This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052 Sheet Thickness: 0.6~2.0mm
Copper thickness: 15um, 18um, 25um, 35um, 70um, others
Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm Thermal conductivity: 0.6W/m.K, 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 2.0W/m.K Protective film: blue film (80ºC), green film (160ºC)
Main Technical Characteristics
| Items | Unit | Test condition | Typical values |
| AF-01 | AF-04 | AF-05 |
| Peel strength | N/mm | At normal: A | 2.00 | 1.05 | 1.08 |
| After thermal stress | 1.80 | 1.05 | 1.05 |
| Surface resistance | MΩ | At normal | 5.0 x 107 | 5.0 x 107 | 3.6 x 107 |
| Constant humidity treatment | 2.0 x 106 | 4.5 x 106 | 3.3 x 106 |
| Volume resistance | MΩ·m | At normal | 4.0 x 108 | 1.0 x 108 | 4.2 x 108 |
| Constant humidity treatment | 5.0 x 107 | 1.9 x 107 | 3.1 x 107 |
| Thermal resistance | ºC/w | At normal | 1.0 | 0.65 | 0.45 |
| Dielectric Constant @ 1 MHz | -- | 40ºC, 93%, 96h | 4.2 | 4.2 | 4.2 |
| Dielectric dissipation factor @1 MHz | -- | 40ºC, 93%, 96h | 0.02 | 0.029 | 0.033 |
| Thermal stress | min | 260ºC | 2 min, no delamination, no air bulb |
| Dielectric breakdown | KV/MM | At normal | 31 | 31 | 60 |
| Flammability | -- | At normal | FV-0 |
| Thermal-conductive factor | W/m·k | At normal | 1.0 | 1.5 | 2.2 |
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