We provide the PCBA/ PCB one-stop custom services/ PCBA Custom service.
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity |
| Layer Counts | 1L-18L, HDI | 20-28 , HDI |
| Material | CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina) |
| PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. |
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide |
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. |
| Plated gold , OSP, Carbon ink, |
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> |
Stencil Size
| 736x736mm |
| Minimum IC Pitch | 0.2mm |
| Maximum PCB size | 510X460mm |
| Minimum PCB thickness | 0.5mm |
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum BGA size: | 74x74mm |
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
| Machine Type | Panasnic CM 402 |
| Panasnic DT301 |
| Panasnic CM 402 | patch speed:0.06sec/ chip (up to 60,000cph) |
| Patch precision:±0.03~±0.005mm |
| PCB size:max:510X460mm,min:50X50mm |
| element size: 0603mm-50X50mm |
| Panasnic DT301 | patch speed:0.7sec/ chip |
| Patch precision:±0.03~±0.005mm |
| PCB size:max:510X460mm,min:50X50mm |
| element size: 1005mm-100X90mmX25mm high speed multifunctional mounter |
| Volume: | One piece to low volume production quantities |
| Low cost first prototype Fab |
| Fast deliveries |
| Assembly type: | SMT assembly |
| DIP assembly |
| Mixed(surface mount and through hole) technology |
| Cable assembly |
| Components type: | Passive components |
| As small as 0402 package |
| As small as 0201 with design review |
| Ball Grid Arrays(BGA): |
| As small as .5mm pitch |
| Component source | Shar,poshiba, ST, |
| Samsng, Infineon, Ti, |
| ON,Microchip etc. |
| Parts procurements: | provide one-stop services |
| Only Assembly service (you supply the parts) |
| You supply some parts(expensive/important components), we do the rest |
| Solder type: | Leaded |
| Lead-free/ROHS compliant |
| Other capabilities: | Repair/rework services |
| Mechanical assembly |
| Box build |
| Mold and plastic injection. |
| Testing Type | First prototype test before mass quantity production |
| AOI |
| BGA X-ray |
| PCB E-test |
| Lead time | According Digikey components delivery time |
Besides, we also offer the customization of all kinds of wiring harness.
• We offer the production and assembling of various electronic cables and communication cables.
• In the aspects of opening, crimping, pre- assembly, and final assembly, we would use verified materials and professional automation equipment.
• To realize the whole process control of quality, we would use the wiring harness detector to test the first piece.
Strong pac kaging, not easily to be damaged or deformed during the long-distance transportation.
