|
US$30,000.00-50,000.00
|
1 Piece
(MOQ)
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Basic Info.
Type
Surface Grinding Machine, Surface Grinding Machine
Processing Object
Flat Workpieces
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Object
Quartz Wafer, Optical Crystal, Glass, Sapphire
Application
Grinding Industry
Service
Oversea Setup & After-Sale Avalaible
Pressure Source
Pneumatic
Plate Material
Metal and Non-Metal
Transport Package
Wood Crate
Production Capacity
500 Unit/Year
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Main features:
1, the AC frequency conversion motor drive, soft start, soft stop, stable and reliable;
2, grinding machine adopts four stages of pressure, namely light pressure, medium pressure, heavy pressure, repair operation process;
3, line grinding machine adopts PLC program control system and torsion series, frequency control, touch screen and operation panel, motor speed and running time can be directly set input;
4, the equipment adopts the millstone lifting mechanism, not the gear ring lifting, belongs to the pneumatic;
5, the upper plate is separately set up slow drop cylinder, not only effectively prevent the fragile workpiece from breaking, but also independent pressure control;
6, through the use of electronic preset counter, grinding cycle number, requirements can be accurately controlled;
7. Diamond dressing wheel can be used to repair the disk.
APPLICATION
| Process | Industry by Substance | Industry by Applicability |
Double Plate Lapping & Polishing | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
| Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
| Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
| Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass |
| Gemstone | jade, sapphire, agate, etc. |
| Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. |
| *NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed. |
SPECIFICATION
| Standard Specification |
| Machine Model | FD6B | FD9B | FD13-6B |
| Lower Plate Diameter | Φ386 mm / 15 inches | Φ640 mm / 25 inches | Φ973 mm / 38 inches |
| Upper Plate Diameter | Φ386 mm / 15 inches | Φ640 mm / 25 inches | Φ973 mm / 38 inches |
| Star Wheel Parameter | DP 12, Z=66, A=20° | DP 12, Z=108, A=20° | DP 19.3, Z=152, A=20° |
| Conditioning Ring Parameter | DP 12, Z=66, A=20° | DP 12, Z=108, A=20° | DP 19.3, Z=152, A=20° |
| Max. Workpiece Diameter | Φ120 mm | Φ180 mm | Φ290 mm |
| Process Thickness | 0.2mm≤N≤20mm | 0.2mm≤N≤25mm | 0.2mm≤N≤30mm |
| Number of Station | 3≤N≤5 | 3≤N≤5 | 3≤N≤5 |
| Plate Rotate Speed | 0-60 rpm | 0-60 rpm | 0-50 rpm |
| Total Weight | 600 kg | 2000 kg | 3200 kg |
| Total Floor Space | 700×950 mm | 1350x960 mm | 1700×1380 mm |
| Built-In Optional Kits |
| Grade | Standard | Advanced |
| Slurry Supply System | - | Integrated with PLC |
| Facing and Grooving System | - | Integrated with PLC |
| Machine Enclosure | - | Framed by Metal Plate |
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION (DOUBLE PLATE) About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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