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Diamond Wire Cutting Tool for Sapphire Silicon Materials Processing Machine

US$48,000.00-200,000.00 1 set (MOQ)

Basic Info.

Model NO.
DA300
Condition
New
Certification
CE, ISO 9001: 2015
Automation
Automatic
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
205X205X300mm
Maximum Running Speed
2400m/Min
Test Cut
Provide Test Cut Service
Dimension
4000X1600X3200mm
Weight
12000kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description
DA300 Multi-wire Saw
This series is mainly used for high-precision cutting of silicon carbide crystals, with advantages of large loading capacity and high wire speed ensuring high precision and high reliability, and achieving a significant increase in production capacity.
It can cut materials in 4~8 inches, the cutting size is flexible according to customers' requirements.
Product Features
>Processing Size
3 wire guide rollers, the maximum processing size can be 8 inches.
>Flexibility
The cutting wire can be flexibly change between slurry and diamond wire to meet different requirements from customers.
>Stability
The take-up and pay-off spools are under the cutting room, it's more stable during machine running.
>High-speed Cutting
The machine is equipped with an upside-down swing cutting structure, which facilitates high-speed sheet cutting.
>Stable Wire Arrangement System
Better design of the guide wheel distance and high-precision detection of wire arrangement, reduce the risk of wire breakage.
>Advanced Tension System
More advanced tension control algorithm and high precision tension sensor.
Cut Samples

Product Parameters
DetailParameter
ModelDA300
Maximum work sizeφ205x300mm
Workbench quantity
1
Roller out diameter*Workable width(φ200±10mm)310x3
Wire diameter
φ0.10-φ0.25mm
Wire spool storage40km(φ0.25mm)
Maximum running speed2400m/min
Travel of table300mm
Table swing±10°
Cutting methodVertically downward movement
Cutting feed speed0.1-99.9mm/min
Tension range5-50N
Tension system accuracy(during cutting)±0.5N
Cutting fluidWater-based cutting fluid
Fluid storage420L
Fluid flow rate12000L/H
Power supply380V±10% 50HZ
Power120Kw
Air supply≥0.4MPa
Size L*W*H4000x1600x3200mm
Weight12000kg

About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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