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Gray High Thermal Conductivity Phase Change Materials PCM

Product Details

Product Details

Product Description

Product Description
Gray High Thermal Conductivity Phase Change Materials PCM
The TIC™808G Series is low melting point thermal interface material. At 50℃, The TIC™808G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™808G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™808G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features
》0.014℃-in² /W thermal resistance
》Naturally tacky at room temperature, no adhesive required
》No heat sink preheating required
Applications
》High Frequency Microprocessors
》Notebook and Desktop PCs
》Computer Serves
》Memory Modules
》Cache Chips
》IGBTs
Typical Properties of TICTM800G Series
Product NameTICTM805GTICTM808GTICTM810GTICTM812GTest Method
ColorGrayGrayGrayGrayVisual
Thickness0.005"0.008"0.010"0.012"
(0.126mm)(0.203mm)(0.254mm)(0.305mm)
Thickness Tolerance ±0.0008''±0.0008''±0.0012''±0.0012''
(±0.019mm)(±0.019mm)(±0.030mm)(±0.030mm)
Density2.6g/ccHelium Pycnometer
Temperature range-25℃~125℃
Phase Change Softening Temperature50℃~60℃
Thermal Conductivity5.0 W/mKASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa)0.014℃-in²/W0.020℃-in²/W0.038℃-in²/W0.058℃-in²/WASTM D5470 (modified)
0.09℃-cm²/W0.13℃-cm²/W0.25℃-cm²/W0.37℃-cm²/W

Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400'(406mm x 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800G series products.
Reinforcement:
No reinforcement is necessary.
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.

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