Product Details
Product Description
Product Description
Large size circuit board PCB
Product: 32 layer high-frequency US military product PCBA
Main installation: SMT+plugin+post soldering
SMT、 DIP、TEST、Helpset、 OEM workers who assemble into one unit, currently the company has 16 SMT production lines that are brand new
YAMAHA high-speed SMT line, with a daily production capacity of 35 million points, equipped with automatic inspection equipment such as X-RAY, AOI, ICT, etc., 4 automatic lines, capable of attaching the smallest component 0.05mm
Plug in (AI) device, 4 DIP lines, 6 post soldering assembly lines
Serial Number Project Manufacturing capability
1 Layers Floors 1-80
2 Maximum size of PCB 2500*1150mm
3 Maximum size of flexible FPC 500mm*100m
4 Maximum size of PCBA 1600mm*1000mm
5 FPCBA maximum size 500mm*100m
6 PCB finished product thickness 0.15-12.0mm
7 Thickness of flexible FPC finished product 0.05-0.60mm
8 Finished copper thickness 12um-1075um
9 Minimum finished aperture of laser hole 0.075mm
10 Minimum line width and spacing 1.5mi/1.50mil
11 Minimum finished hole diameter for through-hole 0.15mm
12 Thickness stacking aspect ratio 1:35
13 By processing methods VIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc
14 Surface Treatment Sinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver
FAQ
Question Point Answer
Q: What information is required for PCB CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required
Q: What information does PCBA need to provide CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.
Question: Is my file secure? CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.
Q: What is the minimum order quantity? CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.
Q: Do you have any other services? CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development
Q: What is your inspection method? How do you control the quality? CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.
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