Product Details
Product Description
Product Description
Brand new & high quality
Joint high intensity
Good immersion
Good insulating ability
Soldering paste for cell phone PCB and SMD like BGA, PGA, etc. Capacity: 10cc
Introduction:
SMT solder Flux USED FOR North and south bridge, cards, cell phone chip, video chip BGA solder, bumping.
are specially formula for BGA reballing / balls works, they not only stick the balls much more well then regular flux, but also provide easy bonding with component pad to balls with typical oven profile.
Also can use off the tin, the effect is very ideal
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