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Enhancement Mode N-Channel Power IGBT

US$0.10-1.00 600 Pieces (MOQ)

Basic Info.

Model NO.
OST30N65FMF TO220F
Working Frequency
High Frequency
Power Level
Medium Power
Function
Power Triode, Switching Triode
Structure
NPN
Material
Silicon
Vces
650V
Vges
30V
Package
To220f
Transport Package
Carton
Specification
35x30x37cm
Trademark
Orientalsemi
Origin
China
HS Code
8541290000
Production Capacity
Over 1kk/Month

Packaging & Delivery

Package Size
59.00cm * 34.00cm * 15.00cm
Package Gross Weight
18.000kg

Product Description

Product Description
General Description
OST30N65FMF uses advanced Oriental-Semi's patented Trident-Gate Bipolar Transistor (TGBTTM) technology to provide extremely low VCE(sat), low gate charge, and excellent switching performance. This device is suitable for mid to high-range switching frequency converters.
Features
. Advanced TGBTTM technology
. Excellent conduction and switching loss
. Excellent stability and uniformity
. Fast and soft antiparallel diode
Applications
. PV inverters
. Induction converters
. Uninterruptible power supplies
Key Performance Parameters
Parameter Value Unit
VCES, min @ 25°C 650 V
Maximum junction temperature 175 °C
IC, pulse 120 A
VCE(sat), typ @ VGE=15V 1.5 V
Qg 54 nC

Marking Information
Product Name Package Marking
OST30N65FMF TO220F OST30N65FM

Package & Pin Information

Absolute Maximum Ratings at Tvj=25°C unless otherwise noted
Parameter Symbol Value Unit
Collector emitter voltage VCES 650 V
Gate emitter voltage
VGES
±20 V
Transient gate emitter voltage, TP≤10µs, D<0.01 ±30 V
Continuous collector current1) , TC=25ºC
IC
42 A
Continuous collector current1) , TC=100ºC 30 A
Pulsed collector current2) , TC=25ºC IC, pulse 120 A
Diode forward current1) , TC=25ºC
IF
42 A
Diode forward current1) , TC=100ºC 30 A
Diode pulsed current2) , TC=25ºC IF, pulse 120 A
Power dissipation3) , TC=25ºC
PD
188 W
Power dissipation3) , TC=100ºC 94 W
Operation and storage temperature Tstg, Tvj -55 to 175 °C
Short circuit withstand time
VGE=15 V, VCC≤400 V
Allowed number of short circuits<1000
Time between short circuits:≥1.0 S

tSC

5

μs

Thermal Characteristics
Parameter Symbol Value Unit
IGBT thermal resistance, junction-case RθJC 0.8 °C/W
Diode thermal resistance, junction-case RθJC 1.65 °C/W
Thermal resistance, junction-ambient RθJA 65 °C/W

Electrical Characteristics at Tvj=25°C unless otherwise specified
Parameter Symbol Min. Typ. Max. Unit Test condition
Collector-emitter
breakdown voltage
V(BR)CES 650 V VGE=0 V, IC=0.5 mA

Collector-emitter saturation voltage

VCE(sat)
1.5 1.63 V VGE=15 V, IC=30 A
Tvj=25°C
1.7 V VGE=15 V, IC=30 A,
Tvj =125°C
1.8 VGE=15 V, IC=30 A,
Tvj =175°C
Gate-emitter
threshold voltage
VGE(th) 4.5 5.5 V VCE=VGE , ID=0.5 mA

Diode forward
voltage

VF
1.75 1.9 V VGE=0 V, IF=30 A
Tvj =25°C
1.64 VGE=0 V, IF=30 A,
Tvj =125°C
1.57 VGE=0 V, IF=30 A,
Tvj =175°C
Gate-emitter
leakage current
IGES 100 nA VCE=0 V, VGE=20 V
Zero gate voltage collector current ICES 10 μA VCE=650 V, VGE=0 V

Dynamic Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Input capacitance Cies 3114 pF
VGE=0 V,
VCE=25 V,
ƒ=100 kHz
Output capacitance Coes 65 pF
Reverse transfer capacitance Cres 2.1 pF
Turn-on delay time td(on) 25 ns
VGE=15 V,
VCC=400 V,
RG=10 Ω,
IC=30 A
Rise time tr 31 ns
Turn-off delay time td(off) 85 ns
Fall time tf 77 ns
Turn-on energy Eon 0.84 mJ
Turn-off energy Eoff 0.61 mJ
Turn-on delay time td(on) 23 ns
VGE=15 V,
VCC=400 V,
RG=10 Ω,
IC=15 A
Rise time tr 13 ns
Turn-off delay time td(off) 119 ns
Fall time tf 52 ns
Turn-on energy Eon 0.38 mJ
Turn-off energy Eoff 0.34 mJ

Gate Charge Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Total gate charge Qg 54 nC
VGE=15 V,
VCC=520 V,
IC=30 A
Gate-emitter charge Qge 26 nC
Gate-collector charge Qgc 10 nC

Body Diode Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Diode reverse recovery time trr 91 ns VR =400 V,
IF=30 A,
diF/dt=500 A/μs Tvj = 25°C
Diode reverse recovery charge Qrr 678 nC
Diode peak reverse recovery current Irrm 14.5 A

Note
1) Calculated continuous current based on maximum allowable junction temperature. 2) Repetitive rating; pulse width limited by max. junction temperature.
3) Pd is based on max. junction temperature, using junction-case thermal resistance.

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