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Qorvo Level 1 Dealer RFPA5542TR13 RF Three-stage Power Amplifier

Product Details

Product Details

Product Description

Product Description
AMPAK AP6256 dealer supplies QFN44 2-in-1 WiFi module integrated IC chip
Basic Features
‌Package Type‌
: QFN-20 (surface mount, suitable for high-density RF circuit design) ‌34
‌Operation frequency‌
: 4.9 GHz ~ 5.925 GHz (covering the 5GHz band, supporting WiFi 802.11a/n/ac standard)‌4
‌Gain‌
: 33 dB (high gain design, improve signal transmission efficiency) ‌13
‌Output Power (P1dB)‌
: 33 dBm (typical linear power 23 dBm, suitable for high linearity scenarios) ‌14
‌Supply voltage/current‌
: 5V / 310 mA (low power optimization, support for high-performance applications)‌34
‌Environmental adaptability
‌Operating temperature‌
: -40°C ~ +85°C (wide temperature design, adapted to harsh environments)‌34
‌Humidity Sensitivity‌
: RoHS compliant (suitable for high reliability scenarios)‌3
‌2. Application scenarios
‌Wireless communication equipment‌
:
Wireless access point (AP), router, gateway device‌4
Customer Resident Equipment (CPE) and Set-top Box Application‌4
‌High frequency system‌
: 5GHz WiFi module, picocell/femtocell base station‌4
‌Integration Advantages‌
:
50Ω matching of input/output terminals reduces layout area and external component requirements‌4
Integrate rate detectors and regulators to simplify design complexity‌4
feature
■pout = 23dBm, 5V, 11AC, 80MHz
MCS9 is 1.8% EVM
■pout = 25dBm, 5V, 11n, 20/40MHz
3% EVM MCS7
■Typical Gain = 33DB
■High pae
■Required external components
Minimize
■Integrated regulator
■Input and output match 50Ω
■Integrated rate detector
Apply
■Customer premise equipment
(CPE)
■Wireless access point, gateway
■Router
■Set-top box application
■picocell/femtocell
RFPA5542 is a three-stage power amplifier (PA) designed
802.11A/N/AC application. Integrated input and output 50Ω matching
Greatly reduces layout area, bill of materials and manufacturing
Costs in customer application. PA is optimized to reduce to a degree
External components are required to maintain linear performance. this
RFPA5542 is a bipolar in advanced INGAP heterojunction
Transistor (HBT) process, capable of achieving linear force
EVM <1.8% 23DBM adds excellent power at the same time
efficiency. The device is available at 4.0mm x 4.0mm x 0.90mm
Packaging that meets or exceeds power requirements
IEEE802.11A/N/AC WiFi RF system

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