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Wafer Fab Fab Feol Beol Semiconductor Device Fabrication Horizontal Back Grinder Mdym-230wh Mdym-300wh

US$15,000.00-50,000.00 1 Piece (MOQ)

Basic Info.

Model NO.
MDYM-230WH MDYM-300WH
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product description: Horizontal back grinder MDYM-230WH MDYM-300WH Application:
suitable for high hardness,thin,and high precision product. like LED sapphire substrate,quartz crystal,silicon wafer,ceramic,wolfram plate, germanium plate thinning(grinding)
Principle:
This machine is automatic precision grinding machine,the sucker/chuck(either vacuum type or electromagnetism type) suck the wafer and rotary opposite from the grinding wheel,the grinding wheel feeding by driving system. this method has low drag force,will not broke the wafer,and high productivity.
This machine can auto aiming the tool, actually test the grinding torque,automatic adjust the grinding speed, so to avoid broking the wafer.
1,Can grind the wafer to 80um, and the planeness and parallelism can be +-0.002mm.
2,High speed, LED sapphire substrate can be 48um/minute, silicon wafer can be 250um/minute.
Specification:
Model YM-150WH YM-180WH YM-200WH YM-230WH YM-300WH
Grinding wheel D150*h25mm D180*h25mm D200*h30mm D230*h30mm D300*h30mm
Max material size D150mm D180mm D200mm D230mm D300mm
Material spindle speed(adjustable) 0-1000rpm 0-1000rpm 0-800rpm 0-800rpm 0-800rpm
Grinding wheel speed(adjustable) 0-2000rpm 0-2000rpm 0-1800 rpm 0-1800 rpm 0-1800 rpm
Grinding wheel motor power 1.5kw/3*380V 1.5kw/3*380V 2.2kw/3*380V 2.2kw/3*380V 2.2kw/3*380V
Material spindle motor power 0.75kw/3*380V 0.75kw/3*380V 0.75kw/3*380V 0.75kw/3*380V 1.1kw/3*380V
Parallelism 1um(for D100mm) 1um(for D100mm) 1um(for D100mm) 1um(for D100mm) 1um(for D100mm)
Dimension(mm) 1200*550*1550 1200*550*1550 1350*600*1600 1350*600*1600 1500*700*1650
Weight 760kg 850kg 960kg 1000kg 1100kg

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