Slug etching machine

Product Details

Product Description

Product Description
Wafer Specifications:
2-8"wafer
Main Materials:
Metal frame+PP/PVC housing,tank material PP/PVDF/PTFE/quartz
Process Tank Functions:
Recirculation filtration+heating and cooling
Basic Process Flow:
MAE acid tank→QDR→MAE acid tank→QDR→C5 acid tank→QDR
Equipment Type:
Manual/semi-automatic/fully automatic(customized)
Footprint:
4000(W)x 1400(D)x 2000(H)mm
(Non-standard)

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