CA4040 Diamond Wire Saw Sapphire Slicing Machine

Product Description

Product Description
CA4040 Multi-wire Saw
CA4040 Multi-wire Saw is mainly used for batch opening square of super hard and brittle materials such as Sapphire, Special Ceramics, Silicon Nitride, etc. into straight sheets. The machine can achieve cutting of super hard and brittle materials through workpiece swing to reduce cutting area. Five rollers design enables the machine to cut products within range of 5-60mm thickness.
Product Features
>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Easy Operation
Roller cutting system, workbench, tension system, take-up and pay-off and wire winding system are set in a plane for easy operation.
>Swing Cutting
The cutting force is stronger with the worktable swing design. Double worktable has an independent servo control system and can run independently.
>Flexible Wire Winding Mode
The rollers quantity can be flexibly changed between 3 and 5 to achieve cutting for products in different sizes.
>Stable Running
Five-roller direct drive structure leads to stable operation of the equipment.
>Wire Break Memory System
Cut Samples

Product Parameters

Detail	Parameter
Model	CA4040
Maximum work size	400x250x400mm
Slice thickness	5-60mm(wire winding number ≤50)
Workbench qty	2
Roller out diameter *Workable width	(φ180±10mm)*260mm*5
Wire diameter	φ0.20mm-φ0.37mm
Wire Spool Storage	40km(φ0.25mm)
Maximum running speed	1000m/min
Travel of workbench lifting	422mm
Workbench swing	±7.5°
Cutting method	Vertically upward movement
Cutting feed speed	0.1-99.9mm/min
Cutting fluid	Water--based cutting fluid or cutting Oil
Fluid storage	800L
Fluid flow rate	200L/min
Power Supply	Three-phase 380V 50Hz
Rated power	42kw
Air supply	≥ 0.4MPa.
SizeL*W*H	3000mm*2200mm*2820mm
Weight	5000Kg

About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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