Product Description
5mw 850nm Vertical Cavity Surface Emitting Laser Die Unmounted Chip Key Features
850nm single wavelength
Low wavelength drift
Oxide isolation technology
Low threshold current
Small emission area
Easy to collimate
Applications
3D sensors
Lidars
IR illuminations
Medical applications
Proximity sensors
Industrial application
5mw 850nm Vertical Cavity Surface Emitting Laser Die Unmounted Chip Packaging Suggestion
For packaging, the user should use high thermal conductive substrate with AlN or copper; the user also attaches die onto the substrate using high thermal conductive materials such as nanosilver gel or AuSn. The user should have the equipments such as die attachment, wire bonder etc., which should be located in 1000 class clean room. For further assistance in need, please feel free to contact us! We would work with you to solve your issues.
Specification
Item No.: VC850G10
| Electrical Optical Characteristics | Typ. |
| Threshold Current | 1.3mA |
| Forward Voltage | 2.0V |
| Differential Resistance | 75Ohms |
| Slope Efficiency | 1W/A |
| Output Power | 6mW |
| Power Conversion Efficiency | 41% |
| Wavelength | 850nm |
| Divergence Angle | 20Deg |
| Size | |
| Die Size | 170umx170um |
| Die Thickness | 130um |
| Number of Emitters | 1 |
| Bond Pad Size(Anode Pad) | 90um |
| Back Electrode Size(Cathode Pad) | 170umx170um |
Dimension About us Hangzhou Brandnew Technology Co., Ltd.
Founded in 2011, BrandNew, the laser diode company, manufactures high-power diode lasers and systems in a wide range of output powers and wavelengths including fiber-coupled, stack bar lasers and plug and play lasers.
Cooperated with Institute of semiconductors Chinese academy of sciences and Zhejiang University, Today, over 60 technicians and 2 scientists, 20 technicians are with PHD degree. Production space is 10000 Class Lab Clean Room with 2000 square meters. Turnover per year is more than 10M US dollars.
BrandNew's strengths are in talent employees, quality engineering,Process control, product development and volume manufacturing.
Core Competency
Diode Packaging Beam Shaping
Reliability Testing Efficient Cooling
FAQ Can you provide technology supports?
Yes, we have a professional technology supporting team for your timely services.
What about the delivery?
We can offer the door to door services by air, just depend on your actual request. Such as DHL, UPS, TNT, FEDEX
What is the lead time?
Normally 3-5 days. Customized products need 15 working days.
Do you have any MOQ limit?
Low MOQ, 1pc for sample checking is available
What is your terms of payment?
T/T or Western Union, for your choice.
Do you offer guarantee for the products?
Yes, all products have been tested before shipping out.
Lifelong technique support. One year warranty.
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