1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the opposite direction by the vacuum suction cup or electromagnetic suction cup, and the grinding wheel swings back and forth. The grinding resistance is small, the workpiece will not be damaged, and the grinding efficiency is high.
2. The equipment can automatically set the tool, actually detect the grinding torque, and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness. APPLICATION
Single
Plate
Lapping
& Polishing | Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
| Semiconductor | LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
| Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
| Phone Frame(flat) | back plate |
| PCB | adhesive, coating, circuit |
| Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass |
| Radar | oxide coating plate |
| Gemstone | jade, sapphire, agate, etc. |
| Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. |
| *NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. |
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
A2:One year warranty and 24 hours online professional technical support. Q3:How to choose a suitable machine? A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
